Patent library
The earlier metal-core-board patents and the newer Thermal PCB application are distinct records. A published application is not a granted patent.
High-Performance Thermally Managed Printed Circuit Board with Integrated Cooling Structures
Liquid Cooled Metal Core Printed Circuit Board
Granted June 20, 2017
Liquid Cooled Metal Core Printed Circuit Board
Granted July 16, 2019
Publication makes the application’s description, claims and drawings publicly available. It does not mean its pending claims have been granted.
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