COLDBOARD / THERMAL ARCHITECTURE
Rethink the board.
Redesign the
thermal path.
Circuit-bearing structures that bring electronics, heat transport and cooling boundaries into one design.
For electronics OEMs, module developers
and manufacturing partners.
A DIFFERENT STARTING POINT
The substrate becomes
part of the thermal system.
A board can do more than support components and carry current.
ColdBoard explores circuit-bearing structures that collect heat, guide it through electrically insulating regions, and deliver it to a cooling interface. In some arrangements, the structure itself forms a wall or partition of the cooling system.
Understand the architectureEXPLORE COLDBOARD
From the internal heat path
to the complete product.
Technology
Thermal networks, electrical isolation, protected interfaces and circuit-bearing walls.
How it works02Cooling designs
Direct liquid, vapor-only and hybrid arrangements, explained with cutaways and sections.
See the arrangements03The compute blade
A proposed sealed ASIC blade designed around a structural board and distributed flow.
Explore the blade conceptCONFIGURABLE COOLING
Different products.
Different cooling boundaries.
Liquid, vapor, or both.
Explore a sealed vapor chamber on one or both PCB faces, direct dielectric flow, or a hybrid arrangement. The external heat path can be designed around a chassis, air-cooled fins or a liquid-cooled interface.
Compare the three design familiesBUILT AROUND YOUR REQUIREMENTS
A platform discussion.
An application-specific design.
Power electronics. Compute. Communications. Lighting.
The most useful starting point is the constraint in your product: a hotspot, isolation requirement, packaging limit or difficult board-to-system interface.
Find your applicationEVALUATION & LICENSING
Bring your thermal constraint.
Explore whether ColdBoard belongs in your next product platform.