HEAT → AIR MCU GPU / FPGA PWR HEAT FLUX MULTILAYER PCB STACK FLUID CHAMBER COPPER THERMAL DIELECTRIC COOLANT THERMAL VIA VAPOR CHAMBER SIGNAL VIA (OFFSET) PCB CROSS-SECTION — COLDBOARD THERMAL ARCHITECTURE
PCB-Integrated Thermal Architecture

The PCB is
the cooling system. 

ColdBoard makes the printed circuit board an active structural element of the cooling system. Thermally conductive layers and networks direct heat from ICs through the PCB and into fluid chambers and vapor chambers — minimizing the resistance between electronics and coolant.

How it works

The board forms the walls.
The board does the work.

Heat generated by ICs is conducted through a multilayer PCB stack built from thermally conductive dielectric materials, channelled by conductive networks, and delivered directly into a thermally conductive fluid chamber wall. The PCB is not a barrier to cooling — it is the cooling path.

Thermally Conductive Dielectrics

Each dielectric layer is engineered for high through-plane thermal conductivity. Rather than impeding heat flow, the substrate actively directs it through the board mass.

Thermal Networks

Networks of thermally conductive materials are built within the PCB stack, creating low-resistance paths that carry heat from IC junctions directly to fluid interfaces.

Cooling Chambers

Fluid chambers are bonded directly to or within the PCB. Coolant flows in direct thermal contact with the board, drawing heat away continuously.

Die-to-Rack Scale

The architecture scales from individual IC junctions to full rack-level thermal management — the same PCB-integrated approach applied at every tier of the system hierarchy.

Performance outcomes

Remove the thermal ceiling on what's possible.

01

Lower junction temperatures

Heat exits ICs through the shortest possible path — through the PCB and into coolant — dramatically reducing junction temperatures under sustained load.

02

Higher sustained power density

When thermal limits are removed, chips run at rated performance continuously. More compute per cubic centimetre, without throttling.

03

Smaller, simpler enclosures

No external heatsinks, fans, or heat pipes. Systems shrink, layouts simplify, and mechanical reliability improves.

04

System-level heat reuse

Liquid-loop cooling enables waste heat recovery — a meaningful advantage in dense deployments and ESG-constrained programs.

↓ Tj 
Reduced junction temperature under load
↑ W/cm²
Higher sustainable power density
Zero
Throttle
Sustained full-speed operation

Performance validated with your hardware during evaluation.

Target sectors

Where thermal limits matter most.

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Licensing & partnerships

Selective, structured access to the architecture.

01 — Evaluation

Fit & Performance

Time-bound evaluation to validate ColdBoard architecture against your hardware, power, and thermal requirements. Typical engagement 3–6 months.

02 — Production Licensing

Royalty or Purchase

Full production licensing with royalty or purchase of geographic rights through financing structures - supported by tech transfer, design guides, and integration collaboration with your E/M teams.

03 — Defense Programs

Government Licensing

Defense and commercial programs via selective sovereign licensing.

ColdBoard technology is protected by issued patents in the United States and Canada, with additional patents pending.

Get in touch

Start a conversation.

Whether you're exploring fit, discussing licensing, or evaluating a specific program — reach out. Technical details available under mutual NDA.